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Immersion coolingTwo-phase immersion
Two-Phase Immersion Cooling Fluid
Two-phase dielectric fluid — maximum thermal dissipation through latent heat of vaporisation
Two-phase immersion cooling (2PIC) dielectric fluid for ultra-high-density data centres. Exploits latent heat of vaporisation for exceptional thermal dissipation: the fluid boils on contact with hot components (~50°C), vapour rises to the condenser and liquid returns by gravity — no pumps. PUE close to 1.03 — the highest possible energy efficiency in server cooling. Particularly suited for high-density GPUs (>700W TDP), ASICs and equipment with rack densities >200 kW. Hermetic system — zero atmospheric emissions.
Standards and specifications
IEC 61068IEC 60296
Specifications
Thermal conductivity0.065 W/m·K (líquido) / alta por cambio de fase
Dielectric strength>40 kV
PresentationIBC 1000L / Sistema cerrado
Temperature range-20°C / +60°C
Custom formulation available
Characteristics
- Latent heat dissipation — up to 10x greater than single-phase cooling
- Pump-free system — thermosyphon gravity circulation
- PUE 1.02–1.05 — maximum energy efficiency
- Boiling point ~50°C — compatible with standard components
- Hermetic system — no emissions and no evaporation
Typical applications
- Ultra-high-density GPU servers (NVIDIA H100, B200, AMD MI300X)
- Data centres >200 kW/rack
- Next-generation ASIC miners
- Real-time AI inference equipment
- Tier 1 supercomputers and HPC clusters
Sectors
Generative AI data centresHPC & supercomputingHigh-performance cryptominingDefence & critical computingScientific research
Key advantages
- Lowest PUE on the market — 1.02 to 1.05
- No recirculation pumps — minimum OPEX and maintenance
- Ultra-high density — >200 kW rack in reduced space
- Hermetic system — zero room contamination risk
- Accelerated ROI vs air cooling
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